Power chips are attached to exterior circuits through product packaging, and their performance depends on the assistance of the packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation refers to the electric connection on the top surface of the chip, which is usually aluminum bonding cord in conventional components. ^
Traditional power module plan cross-section

Currently, commercial silicon carbide power components still mainly make use of the product packaging technology of this wire-bonded conventional silicon IGBT component. They face problems such as big high-frequency parasitic specifications, not enough heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit using silicon carbide semiconductors. The display screen of exceptional performance. In order to solve these troubles and fully make use of the substantial potential advantages of silicon carbide chips, numerous new packaging innovations and solutions for silicon carbide power modules have arised recently.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have established from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold cords to copper cables, and the driving force is price decrease; high-power devices have established from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The better the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging approaches, Cu Clip innovation has the adhering to advantages:

1. The connection in between the chip and the pins is made from copper sheets, which, to a particular level, replaces the conventional cord bonding method in between the chip and the pins. Consequently, an unique package resistance worth, greater existing circulation, and far better thermal conductivity can be gotten.

2. The lead pin welding area does not require to be silver-plated, which can completely conserve the cost of silver plating and inadequate silver plating.

3. The item look is totally regular with typical items and is primarily made use of in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other fields.

Cu Clip has two bonding techniques.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more costly and complicated, however it can accomplish much better Rdson and far better thermal impacts.

( copper strip)

Copper sheet plus wire bonding method

The resource pad uses a Clip technique, and the Gate uses a Cable method. This bonding technique is somewhat less expensive than the all-copper bonding approach, saving wafer area (suitable to very tiny entrance locations). The process is simpler than the all-copper bonding approach and can get much better Rdson and far better thermal impact.

Distributor of Copper Strip

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